Google is reportedly deepening its investment in custom chip development through a long-term manufacturing agreement with TSMC, the world’s leading semiconductor foundry.
Highlights
The partnership, according to a report from China-based sources and corroborated by DigiTimes, will center on producing future generations of Tensor system-on-chips (SoCs) for Google’s Pixel smartphones—beginning with the Tensor G5 expected to debut in the Pixel 10 series in 2025.
This marks a shift from Google’s previous reliance on Samsung Foundry, which produced earlier versions of the Tensor chips.
Transition to TSMC and the 3nm Process Node
The Tensor G5 chip will reportedly be manufactured using TSMC’s advanced 3nm-class N3E process, the same node utilized for Apple’s A18 Pro and M4 chips.
This upgrade from Samsung’s 4nm-class process is expected to bring notable improvements in both power efficiency and computational performance.
According to reports, Google executives have visited TSMC’s headquarters in Taiwan to finalize this multi-year agreement. The deal reflects Google’s intent to establish greater control over its silicon roadmap, similar to Apple’s vertical integration strategy.
Redesigned Architecture and Component Overhaul
The Tensor G5 is said to represent a major architectural shift, moving away from Samsung-developed components to a blend of in-house designs and new suppliers.
- GPU: Transition from ARM Mali to Imagination Technologies’ DXT-48-1536, offering ray tracing support and GPU virtualization.
- Video Codec: Replacing Samsung’s MFC with Chips&Media’s WAVE677DV for video encoding/decoding.
- Display Controller: Switching to VeriSilicon’s DC9000, replacing Samsung’s DPU.
- Image Signal Processor (ISP): Introduction of a fully custom ISP, designed internally by Google.
- Modem: Adoption of a MediaTek modem, replacing Samsung’s modem used in earlier Tensor chips.
AI Capabilities and Performance Improvements
The Tensor G5 is expected to include several new components aimed at enhancing on-device AI processing:
- A next-gen EdgeTPU, offering a 40% increase in TOPS (Trillions of Operations Per Second).
- Support for on-device machine learning training.
- Integration of embedded RISC-V cores for AI task management.
- Introduction of an Always-on Compute Audio Processor (AoC) and “Emerald Hill” memory co-processor to improve power efficiency and contextual performance.
Internal benchmarks reportedly indicate a 14% improvement in real-world performance over the Tensor G4.
Camera and Imaging Enhancements
With the shift to a fully custom ISP, the upcoming Pixel 10 series could see up to a 50% improvement in camera processing. Google is expected to build on its software-led approach to photography by aligning it more closely with purpose-built hardware components.
Pixel 10 Series Launch Timeline
The Pixel 10 series is expected to launch in August 2025, with multiple variants planned:
- Pixel 10
- Pixel 10 Pro
- Pixel 10 Pro XL
- Pixel 10 Pro Fold (a foldable model, reportedly under consideration)
Collaboration Beyond Smartphones
The long-term agreement between Google and TSMC is also expected to extend beyond consumer hardware.
Reports suggest the partnership may involve custom AI chips for cloud infrastructure, including future TPUs (Tensor Processing Units) and server cooling solutions—further aligning with Google’s push into large-scale AI infrastructure.
This collaboration highlights Google’s intent to build a vertically integrated hardware ecosystem with tighter control over performance, battery efficiency, and AI capabilities.
By shifting to TSMC and overhauling its chip architecture, Google is positioning itself to better compete with both Apple’s in-house silicon and Qualcomm’s Snapdragon platform.
