Qualcomm is reportedly working on a new high-performance mobile chipset for 2026, potentially branded as the Snapdragon 8 Plus.
Highlights
- Next-Gen Performance: The SM8845 is rumored to offer near-flagship performance, positioned just below the Snapdragon 8 Elite 2 launching in 2025.
- Bridging the Gap: Strategically aimed at creating a new premium tier between Qualcomm’s 2024 and 2026 flagships for more affordable flagship-level devices.
- 3nm N3P Process: Manufactured on TSMC’s advanced 3nm node—same as Elite 2—suggesting major gains in efficiency and performance.
- Custom Oryon Cores: First non-flagship chip expected to fully integrate Qualcomm’s custom Oryon CPU cores, reaching clock speeds above 3GHz.
- Gaming and AI Focus: Designed for devices with large batteries (up to 8,000mAh), enhanced GPU, and AI capabilities—ideal for gaming phones and AR devices.
- Mid-Cycle Strategy: Continues Qualcomm’s tradition of “Plus” variants as mid-year refreshes with refined hardware before new flagship rollouts.
- Elite Features at Lower Price: May inherit features like LPDDR5x, UFS 4.0, and Nanite rendering, delivering near-Elite experiences without the premium cost.
- OEM Adoption: Brands like OnePlus, Vivo, and Redmi could adopt the chip for “affordable premium” smartphones with top-tier capabilities.
- Launch Timeline: Expected announcement in Q4 2025, with commercial devices launching in early-to-mid 2026.
According to well-known tipster Digital Chat Station on Weibo, the processor—codenamed SM8845—is expected to sit just below Qualcomm’s upcoming Snapdragon 8 Elite 2, while delivering performance close to that of the current Snapdragon 8 Elite, released in late 2024.
Positioned Between Flagships
Qualcomm might be aiming to create a premium-tier chipset that bridges the performance and pricing gap between its flagship chips of 2024 and 2026.
By offering a tier just beneath its top-end SoC, Qualcomm may give OEMs more flexibility to produce high-performance smartphones at relatively accessible prices, targeting users who want flagship-grade performance without the associated premium cost.
The SM8845 is expected to be manufactured using TSMC’s 3nm N3P process—the same node as the Snapdragon 8 Elite 2.
It may also share certain hardware components with the Elite 2, although specific details are currently unclear.
The architecture is reportedly built on large custom CPU cores, continuing Qualcomm’s strategy of leveraging custom Oryon cores for a balance of performance and efficiency.
Power and Performance
Devices powered by this chipset may support batteries with capacities up to 8,000mAh, hinting at use cases such as gaming-focused phones or high-end multimedia devices that benefit from longer battery life and sustained performance.
To provide context, the Snapdragon 8 Elite features a 64-bit custom Oryon octa-core CPU, clocked up to 4.32GHz. It’s built on a 3nm process, offers LPDDR5x RAM, UFS 4.0 storage, and supports Nanite rendering from Unreal Engine 5, enabling near-console-grade visuals on mobile devices.
If the Snapdragon 8 Plus matches similar benchmarks, it could become an appealing choice for devices targeting high-end experiences without the latest-generation pricing.
Mid-Cycle Refresh
The Snapdragon 8 Plus appears to continue Qualcomm’s established pattern of releasing “Plus” versions as mid-cycle refreshes—similar to the Snapdragon 8+ Gen 1.
These versions often benefit from process optimizations and refined binning, delivering meaningful performance and efficiency gains ahead of full flagship launches.
By offering an enhanced variant using the same N3P process as its upcoming flagship, Qualcomm could accelerate time-to-market for advanced hardware without waiting for the complete rollout of the Snapdragon 8 Elite 2.
Creating a New Performance Tier
Internally referred to as either Snapdragon 8s Gen 5 or 8 Plus, the SM8845 may introduce a new category within Qualcomm’s lineup—positioned between the Snapdragon 8 Elite and Elite 2.
OEMs such as Oppo, Vivo, OnePlus, and Redmi could potentially adopt this chip for affordable flagship devices with high-end GPU and AI capabilities, including support for larger batteries and enhanced gaming performance.
Full Custom Oryon Core Integration
Unlike previous Snapdragon “S” series chips, the SM8845 is expected to utilize full custom Oryon CPU cores, similar to those found in the Elite variant.
This would mark the first time Qualcomm extends its proprietary Oryon architecture to a non-flagship tier, potentially allowing the chip to reach clock speeds above 3GHz while maintaining better thermal and power efficiency.
This shift also signals Qualcomm’s intent to expand its custom architecture across a broader range of products, enhancing performance without depending solely on ARM’s reference designs.
Competitive Positioning in the AI Era
Although unrelated to direct competition with AI models like OpenAI’s Sora 2, the Snapdragon 8 Plus may serve as a more accessible hardware platform for mobile devices focused on demanding use cases—such as AR, on-device AI processing, and high-frame-rate gaming.
Its performance capabilities and cost-effective nature could position it as an attractive option for manufacturers seeking balance between innovation and affordability.
Rollout Timeline
Current rumors indicate a Q4 2025 announcement, potentially during Qualcomm’s Snapdragon Summit, with commercial deployment following in early to mid-2026.
This timeline would allow device makers to prepare 2026 smartphone models that incorporate the new chip for premium, yet more budget-conscious segments.
The Snapdragon 8 Elite 2 is expected to launch in September 2025, and the Snapdragon 8 Plus could offer a near-flagship experience shortly afterward—without being tied directly to flagship pricing.
Although Qualcomm has not officially confirmed the existence of the Snapdragon 8 Plus (SM8845), the reported specifications are in line with the company’s strategy of introducing high-performance alternatives ahead of major flagship releases.
More details are likely to emerge as Qualcomm finalizes its 2025–2026 product roadmap.
